Electroplating
Acid Copper Plating for PCBs: Chemistry That Follows the Via
PCB copper plating asks something decorative plating never does: deposit metal evenly down a hole ten times deeper than its diameter. That 'throwing power' comes from tightly controlled acid copper chemistry — high acid, low copper, chloride in the narrow 40–80 ppm window, and a disciplined additive system.
Raw material purity is non-negotiable
Plating-grade copper sulphate with controlled iron and organic content, phosphorised anodes (0.03–0.06% P) that form the black film preventing rough deposits, and DI water for make-up. Cheap copper sulphate with trace organics shows up as dull, brittle deposits and voided holes weeks later.
Additive discipline
Brightener (accelerator), carrier (suppressor) and leveller work as a balanced system — dosing one to fix a symptom unbalances the others. CVS analysis or at minimum systematic hull-cell panels beat guesswork. Carbon treat on schedule; additive breakdown products are cumulative.
We supply plating-grade copper sulphate, phosphorised anodes and acid copper additive systems to PCB and decorative platers, with COAs on every lot.
Frequently Asked Questions
The 0.04–0.06% phosphorus forms a black film on the anode that controls dissolution, preventing particulate roughness in the deposit — plain copper anodes sludge heavily.
Need this chemistry for your process?
JSM Traders supplies the products discussed here with COA and MSDS, PAN India. Quotations within working hours.
